Final finishes, protective layers
Organic, chemical or galvanic protective layers serve to protect the end surfaces of printed circuit boards from oxidation and corrosion. Special system technology in connection with high-quality process chemistry guarantee a high-quality surface finish of printed circuit boards.
As an additional process step
The final surface treatment of the different circuit board variants can be integrated into the COMPACTA device series as an additional process step.
The system structure is based on the protective layer variant and the respective process steps of the process chemistry.
COMPACTA MD with additional basin Chem. Nickel / Gold Chem. Zinn OSP
For the final surface treatment of printed circuit boards
LDI direct exposure
Special LDI technology in combination with a drawer vacuum system and versatile equipment guarantee optimal exposure results and short exposure times.
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COMPACTA single device end surface chem. Nickel / gold chem. Tin OSP
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