Walter Lemmen

Multilayer

Multilayer     

In order to achieve the high information density of a circuit board in the smallest space, multilayer production comes into consideration, in which several circuit boards are pressed with so-called prepregs.

The compact multilayer press for multilayer circuits enables the pressing of multilayer boards. The optimal pressure and heat distribution of the press guarantees that the individual layers are pressed evenly.

In combination with the exposure, development, etching and through-hole plating systems, high-quality multilayers can be produced in the shortest possible time.


AKTINA S series

Hydraulic multilayer press MLP-L series with touch panel

For the production of multi-layer circuit boards with a maximum laminating area of 300 x 400mm or 310 x 460mm.

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