Walter Lemmen

Through hole plated technology 

Via
For the galvanic through-hole plating process, we offer our COMPACTA device series as a universally applicable electroplating system for the chemical or galvanic deposition of metals in vertical technology. In coordination with the customer, the systems are adapted according to the required process steps. The standard process is based on the environmentally friendly direct metallization with graphite as a catalyst according to the tenting or subtractive process.


AKTINA S series

COMPACTA MD through-hole plating

For the production of through-hole printed circuit boards

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